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G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造 StdPbc-0103 本スタンダードは,308 kPa (44

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Description

本スタンダードは,308 kPa (44

With increased levels of integration

This Standard is applicable to FPD

previously published March 2005

With the growth of the photovoltaic market

G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造 StdPbc-0103 本スタンダードは,308 kPa (44CurrentInactiveInactiveSEMI 1996 CerDIP CerDIP 2 Referenced SEMI Standards SEMI G2 Specification Metallic Leadframes for Cer Dip Packages SEMI G20 Specification Lead Finishes for Plastic Packages (Active Devices only) SEMI G23 Test Method Measuring the Inductance of Package Leads SEMI G24 Test Method Measuring the Lead to Lead and Loading Capacitance of Package Leads SEMI G25 Test Method Measuring the Resistance of Package Leads SEMI G30 Test Method

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